WCu Electronic Packaging Materials for Thermal Management and Expansion Matching
Composite material solutions for electronic assemblies that need high heat dissipation and controlled thermal expansion.
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Key Features & Benefits
Discover why our products are trusted by industries worldwide
High Thermal Conductivity
Thermal conductivity >170-210 W/m·K supporting high heat flux device heat dissipation.
Controlled Thermal Expansion
Lower thermal expansion coefficient than copper, beneficial for packaging reliability.
Dimensional Stability
Good dimensional stability under thermal load for precision-machined thermal parts.
Grade Matching
Supports grade matching for different structures and thermal design requirements.
High-Power Applications
Suitable for IGBT, power modules, RF devices, and high-density electronic designs.
Precision Machined Parts
Can supply semi-finished or precision machined parts per drawings.
Technical Specifications
Detailed parameters for your engineering requirements
| Material System | W-Cu Composite |
| Grade Range | WCu50-WCu10 |
| Thermal Conductivity | >170-210 W/m·K |
| Product Forms | Plates, Blocks, Discs, Custom Parts |
| Processing | Semi-finished or Machined per Drawing |
| Surface Condition | Machined, Ground, Substrate before Plating |
Application Areas
Versatile solutions across multiple industries
Power Modules & Semiconductors
IGBT, power modules, and high-power semiconductor packaging with bottom plates and heat sinks.
RF & Microwave Devices
Microwave devices and RF modules requiring high-stability heat dissipation and structural bases.
Laser & Optoelectronic
Lasers, optoelectronic devices, and heat dissipation bases for high heat flux devices.
Electronic Packaging
Heat sinks, substrates, heat dissipation blocks, and base plates for thermal management.
Product Gallery
Explore our precision-engineered materials and components.
Balancing thermal conductivity, expansion, and structural stability
In electronic packaging, the material must move heat away from the device while staying compatible with the expansion behavior of adjoining materials. Tungsten copper is widely used for this reason.
WCu Electronic Packaging Materials are composite material systems composed of tungsten and copper, combining the low thermal expansion and high strength of tungsten with the high thermal conductivity and electrical conductivity of copper.
Manufacturing & Quality Control
WCu electronic packaging materials are typically manufactured using tungsten skeleton sintering followed by copper infiltration for uniform structure and stable performance.
- Tungsten skeleton pore structure control
- Copper infiltration completeness and uniformity
- Structure density and composition stability
- Thermal conductivity and thermal expansion matching control
- Surface flatness and machining accuracy
Selection Recommendations
Choose the right WCu grade for your application:
- **Packaging thermal management**: confirm device heat flux and thermal expansion matching requirements
- **Subsequent plating, brazing, or welding**: confirm surface treatment and substrate compatibility
- **High-power applications**: focus on thermal conductivity and CTE matching with semiconductor materials
RFQ Guide
For thermal management components, please include:
1. Required WCu grade or target thermal conductivity level
2. Part drawings or target dimensions
3. Whether flatness or precision machining is required
4. End application type (power module, RF device, laser, etc.)
5. Whether plating, brazing, or packaging process is involved
6. Batch requirements
Need WCu Material Solutions for Your Packaging Design?
Send device type, thermal design goals, or part drawings, and we will help match more suitable grades, processing methods, and delivery specifications.