
Factory production workflow
Material preparation, forming or machining route, finishing, inspection, packing, and shipment are reviewed as one supply workflow, not as isolated catalog items.
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High-performance WCu alloy engineered for demanding applications requiring the right balance of thermal conductivity, electrical conductivity, strength, and dimensional stability.
Talk on WhatsAppManufacturing details, inspection discipline, and RFQ clarity for industrial buyers.
Thermal conductivity >170-210 W/m·K for fast and reliable heat dissipation in demanding applications.
Lower thermal expansion coefficient than pure copper, better matching electronic packaging materials.
Good electrical conductivity for current-carrying and contact-related components, improving with higher copper content.
Combines tungsten strength with copper conductivity for optimal performance in thermal and electrical applications.
Available in grades from WCu50 to WCu10 to match different density, conductivity, and thermal performance targets.
Customer-specific dimensions, assemblies, and application needs with semi-finished or machined parts.
Hard Proof for Buyers
Industrial buyers need more than broad claims like high performance or stable quality. This section shows the practical proof points we can discuss before quotation: factory workflow, inspection control, report availability, MOQ, lead time, packing, and export support.

Material preparation, forming or machining route, finishing, inspection, packing, and shipment are reviewed as one supply workflow, not as isolated catalog items.

Dimensional checks, surface review, batch identification, and inspection records can be aligned with the product drawing, specification, or repeat-order requirement.

Engineering RFQs can include drawings, samples, grade targets, tolerance notes, working conditions, and report requirements before quotation.

Protective packing, labeling, batch notes, and export-ready documentation are considered before sample, trial, or production shipment.
MOQ: confirmed by grade, size, drawing complexity, and trial or repeat-order demand
Sample / trial order: available for qualified RFQs where size, quantity, and application are clear
Lead time: quoted by stock status, tooling route, machining complexity, inspection scope, and order quantity
Reports: material report, dimensional inspection record, and shipment photos can be discussed before order
Tolerance: typical capability is reviewed against drawings, process route, and critical working surfaces
Export support: protective packing, marking, trade terms, and destination requirements can be aligned before shipment
Quality system: batch traceability, incoming material review, and final inspection are available for repeat supply
Confidentiality: drawings and samples are used for quotation/manufacturability review; NDA available on request
Detailed parameters for your engineering requirements
| Material Type | WCu Composite Alloy |
| Grades | WCu50, WCu40, WCu30, WCu25, WCu20, WCu15, WCu10 |
| Thermal Conductivity | >170-210 W/m·K |
| Density | Per grade specification |
| Product Forms | Plates, Rods, Blocks, Discs, Custom Parts |
| Applications | Electronic Packaging, Heat Sinks, Electrical Contacts |

Application-specific supply for industrial production and maintenance teams.

IGBT, power modules, and high-power semiconductor packaging with thermal expansion control and heat transfer requirements.

Heat sink applications demanding efficient thermal conductivity and stable operation under high thermal loads.

Electrical contact parts requiring dependable conductivity, wear resistance, and service stability.

Microwave devices and RF modules requiring high-stability heat dissipation and structural bases.
Explore our precision-engineered materials and components.
Our Tungsten Copper Alloy (WCu) is designed for customers who need a composite material that combines the high-temperature resistance and dimensional stability of tungsten with the excellent thermal and electrical conductivity of copper.
WCu composite materials provide a more practical comprehensive solution for electronic packaging and thermal management applications, especially for power device systems requiring thermal matching and structural reliability.

Our tungsten copper alloy products are manufactured through tungsten skeleton sintering followed by copper infiltration for uniform structure and stable comprehensive performance.

Choose the right WCu grade for your application:

For a faster quotation, please include:
1. Required WCu grade such as WCu50, WCu30, or WCu10
2. Product form and dimensions needed
3. Thermal or electrical performance requirements
4. Density or conductivity target if specified
5. Drawing, tolerance, or machining requirements
6. Order quantity and end-use application

Send us your grade, dimensions, and technical requirements for a fast quotation and application-focused recommendation.