Tungsten Copper Alloy for Thermal Management and Electrical Performance
High-performance WCu alloy engineered for demanding applications requiring the right balance of thermal conductivity, electrical conductivity, strength, and dimensional stability.
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Key Features & Benefits
Discover why our products are trusted by industries worldwide
High Thermal Conductivity
Thermal conductivity >170-210 W/m·K for fast and reliable heat dissipation in demanding applications.
Controlled Thermal Expansion
Lower thermal expansion coefficient than pure copper, better matching electronic packaging materials.
Excellent Electrical Conductivity
Good electrical conductivity for current-carrying and contact-related components, improving with higher copper content.
Material Balance
Combines tungsten strength with copper conductivity for optimal performance in thermal and electrical applications.
Multiple Grade Options
Available in grades from WCu50 to WCu10 to match different density, conductivity, and thermal performance targets.
Machinable & Customizable
Customer-specific dimensions, assemblies, and application needs with semi-finished or machined parts.
Technical Specifications
Detailed parameters for your engineering requirements
| Material Type | WCu Composite Alloy |
| Grades | WCu50, WCu40, WCu30, WCu25, WCu20, WCu15, WCu10 |
| Thermal Conductivity | >170-210 W/m·K |
| Density | Per grade specification |
| Product Forms | Plates, Rods, Blocks, Discs, Custom Parts |
| Applications | Electronic Packaging, Heat Sinks, Electrical Contacts |
Application Areas
Versatile solutions across multiple industries
Electronic Packaging
IGBT, power modules, and high-power semiconductor packaging with thermal expansion control and heat transfer requirements.
Heat Sinks
Heat sink applications demanding efficient thermal conductivity and stable operation under high thermal loads.
Electrical Contacts
Electrical contact parts requiring dependable conductivity, wear resistance, and service stability.
RF & Microwave
Microwave devices and RF modules requiring high-stability heat dissipation and structural bases.
Product Gallery
Explore our precision-engineered materials and components.
A composite material engineered for thermal and electrical balance
Our Tungsten Copper Alloy (WCu) is designed for customers who need a composite material that combines the high-temperature resistance and dimensional stability of tungsten with the excellent thermal and electrical conductivity of copper.
WCu composite materials provide a more practical comprehensive solution for electronic packaging and thermal management applications, especially for power device systems requiring thermal matching and structural reliability.
Manufacturing & Quality Control
Our tungsten copper alloy products are manufactured through tungsten skeleton sintering followed by copper infiltration for uniform structure and stable comprehensive performance.
- Tungsten skeleton pore structure control
- Copper infiltration completeness and uniformity
- Structure density and composition stability
- Thermal conductivity and thermal expansion matching
- Surface flatness and machining accuracy
Selection Recommendations
Choose the right WCu grade for your application:
- **Packaging thermal management**: confirm device heat flux and thermal expansion matching requirements
- **Electrical contacts**: specify current load, conductivity requirements, and arc working conditions
- **Subsequent nickel plating, brazing, or welding**: confirm surface treatment and substrate compatibility in advance
RFQ Guide
For a faster quotation, please include:
1. Required WCu grade such as WCu50, WCu30, or WCu10
2. Product form and dimensions needed
3. Thermal or electrical performance requirements
4. Density or conductivity target if specified
5. Drawing, tolerance, or machining requirements
6. Order quantity and end-use application
Need the Right WCu Grade for Your Thermal or Electrical Application?
Send us your grade, dimensions, and technical requirements for a fast quotation and application-focused recommendation.